Display device

ABSTRACT

The present invention realizes a display device having C-MOS p-Si TFTs which enable the high integration by reducing spaces for P-MOS TFTs and N-MOS TFTs in driving circuit or the like thereof. The present invention adopts a self-aligned C-MOS process which uses a half tone mask as an exposure mask for manufacturing the C-MOS p-Si TFTs mounted on the display device. With the use of the half tone mask, the alignment or positioning at a bonding portion between a P-MOS portion and an N-MOS portion becomes unnecessary and hence, the number of photolithography steps can be reduced and the high integration of C-MOS TFT circuits can be realized.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a display device, and more particularly to a display device in which C-MOS thin film transistors which are highly integrated with small number of manufacturing steps are provided to active elements on a display region or to driving circuit for controlling the display region.

[0002] There has been observed a tendency that a flat-panel type display device which uses liquid crystal or organic EL uses polysilicon thin film transistors (p-Si TFT) which are advantageous for high definition and fast operation as driving circuits or active elements. In a display device which uses these low-temperature polysilicon thin film transistors, by directly building driving circuits in a periphery of a substrate of the display device, it is possible to reduce the number of external connection terminals so that a manufacturing cost can be reduced.

BRIEF SUMMARY OF THE INVENTION

[0003] Of the p-Si TFT used in the driving circuit of the display device, a shift register particularly adopts the C-MOS constitution in view of demands for low power consumption and fast operation. To manufacture such a highly integrated C-MOS p-Si, it is necessary to perform a photolithography method or a photolithography step (patterning method or process using exposure mask and etching, hereinafter referred to as “photo step”) many times and this pushes up a manufacturing cost of the whole display device. Further, these polysilicon thin film transistors are also used in active elements for selecting pixels simultaneously.

[0004] The C-MOS p-Si TFT (hereinafter also referred to as “C-MOS TFT”) is constituted of a pair of a P-MOS p-Si TFT (hereinafter referred to as “P-MOS TFT”) and a N-MOS p-Si TFT (hereinafter referred to as “N-MOS TFT”). In manufacturing the C-MOS TFT, although N-MOS TFT is arranged close to the P-MOS TFT, it is necessary to align the N-MOS TFT with the P-MOS TFT. Recently, the N-MOS TFT can be simply manufactured by adopting a so-called self-aligned LDD process. Using this process, it is possible to manufacture the C-MOS TFT with small number of photo steps.

[0005]FIG. 9 is a top plan view which schematically shows the constitution of one example of a conventional C-MOS TFT mounted on a display device. Reference symbol 13 indicates a gate electrode of a P channel portion, reference symbol 13′ indicates a gate electrode of an N channel portion, reference symbol 17 indicates contact holes, reference symbol 31 indicates an N⁺ portion, reference symbol 32 indicates an N⁻ portion, reference symbol 34 indicates an P⁺ channel portion, reference symbol 25 indicates a P channel portion, and reference symbol 26 indicates an N channel portion. AC-MOS TFT element circuit is constituted of the P channel portion 25 having the P⁺ portion 34 and the N channel portion 26 having the N⁺ portion 31 and the N⁻ portion 32. The gate electrode 13 of the P channel portion 25 and the gate electrode 13′ of the N channel portion 26 have an alignment portion 35 at a portion where both parts are connected to each other.

[0006] However, in manufacturing the C-MOS TFT using this process, a space for alignment of bonding portions of the P-MOS TFT and the N-MOS TFT is extremely enlarged and hence, the high integration becomes difficult. Accordingly, it is difficult to realize the display device of high definition and rapid driving.

[0007] It is an object of the present invention to realize a display device having the p-Si TFT of C-MOS constitution in a driving circuit or the like which can reduce the space for bonding portions of the P-MOS TFT and the N-MOS TFT.

[0008] To achieve the above-mentioned object, the present invention realizes the high integration of a C-MOS TFT provided to a display device by adopting a self-aligned C-MOS process which uses half exposure masks (half tone masks) as exposure masks for manufacturing of the C-MOS TFT. With the use of the half tone masks, the number of photo steps can be reduced, the alignment of bonding portions of a P-MOS TFT and a N-MOS TFT becomes unnecessary so that a display device of high definition and rapid driving can be realized. To describe typical constitutions among constitutions of the display device according to the present invention, they are as follows.

[0009] (1) The display device includes a thin film transistor substrate which is provided with C-MOS thin film transistors which have the difference in width between a gate electrode of a P channel portion and a gate electrode of an N channel portion.

[0010] (2) The difference in width of gate electrode in the constitution (1) is equal in the width direction of the gate electrode of the P channel portion and the gate electrode of the N channel portion.

[0011] (3) In the P channel portion of the constitution (1) or (2), a P⁺ semiconductor region and an N⁻ doping region are present.

[0012] (4) The concentration of P⁺ doping atoms in the P⁺ semiconductor region which constitutes the P channel portion is about 10¹⁵ cm⁻² and the concentration of N⁻ doping atoms in the N⁻ doping region is about 10¹³ cm⁻² in the constitution (3).

[0013] (5) The P⁺ semiconductor region in the constitution (1) or (2) includes N⁻ doping atoms as impurities.

[0014] Due to the above-mentioned respective constitutions of the present invention, it is possible to realize the display device having C-MOS TFTs which reduce spaces for P-MOS TFTs and N-MOS TFTs in driving circuits or the like thereof.

[0015] Here, it is needless to say that the present invention is not limited to the above-mentioned constitutions and the constitutions of embodiments explained later and various modifications are conceivable within the scope of the technical concept of the present invention.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

[0016]FIG. 1 is a top plan view schematically showing the constitution of a C-MOS p-Si TFT element provided to a display device according to the present invention.

[0017]FIG. 2 is an enlarged view of a portion A in FIG. 1.

[0018]FIG. 3 is a schematic view for explaining the basic constitution of a half exposure mask used in manufacturing of the C-MOS p-Si TFT of the present invention.

[0019]FIG. 4 is a manufacturing process of the C-MOS p-Si TFT for explaining one embodiment of the present invention.

[0020]FIG. 5 is a manufacturing process view of the C-MOS p-Si TFT which follows FIG. 4 for explaining one embodiment of the present invention.

[0021]FIG. 6 is a manufacturing process view of the C-MOS p-Si TFT for explaining another embodiment of the present invention.

[0022]FIG. 7 is a manufacturing process view of the C-MOS p-Si TFT for explaining one example of the prior art.

[0023]FIG. 8 is a manufacturing process view of a C-MOS p-Si TFT by a self-aligned LDD for explaining another embodiment of the prior art.

[0024]FIG. 9 is a top plan view for schematically showing the constitution of one example of a conventional C-MOS p-Si TFT element provided to a display device.

DETAILED DESCRIPTION OF THE INVENTION

[0025] Preferred embodiments of the present invention are explained in detail in conjunction with drawings which show these embodiments hereinafter.

[0026] Although the display device of the present invention is explained only with respect to a thin film transistor substrate which constitutes a display device of the present invention, when the display device is a liquid crystal display device, the display device is constituted by laminating a counter substrate to the thin film transistor substrate by way of liquid crystal. Further, when the display device is an organic EL display device, the display device is constituted by applying organic EL layers to pixel electrodes selected by the thin film transistor substrate and providing counter electrodes which sandwich the above-mentioned organic EL layer with the pixel electrodes.

[0027]FIG. 1 is a top plan view for schematically showing the constitution of a C-MOS TFT element provided to the display device according to the present invention. Further, FIG. 2 is an enlarged view of a portion A in FIG. 1. Reference symbol 11 indicates an N⁺ portion, reference symbol 13 indicates a gate electrode of a P channel portion, reference symbol 13′ indicates a gate electrode of an N channel portion, reference symbol 14 indicates an N⁻ portion, reference symbol 15 indicates a P⁺ portion, reference symbol 17 indicates contact holes, reference symbol 25 indicates a P channel portion, and reference symbol 26 indicates an N channel portion. A C-MOS TFT element circuit is constituted of the P channel portion 25 having the N⁻ portion 14 and the P⁺ portion 15 and the N channel portion 26 having the N⁺ portion 11 and the N⁺ portion 14. The gate electrode 13 of the P channel portion 25 and the gate electrode 13′ of the N channel portion 26 are connected to each other at a connection portion in the portion A. In this manner, the gate electrode 13 and the gate electrode 13′ are arranged on a same straight line. It is needless to say that this straight line shape may curve more or less in manufacturing. However, here, “on the straight line” in this embodiment means a substantially straight line and such a curved straight line shape may also achieve an advantageous effect that the high integration can be achieved by reducing a space for the C-MOS TFT and hence, there arises no problem with respect to such a curved straight line shape.

[0028] As shown in an enlarged form in FIG. 2, at the connection portion of the P channel portion 25 and the N channel portion 26, size changes ΔS in width are generated between the gate electrode 13 of the P channel portion 25 and the gate electrode 13′ of the N channel portion 26. In this embodiment, the width of the gate electrode of the N channel portion is set narrower than the width of the gate electrode of the P channel portion. This is because that when a half exposure mask shown in FIG. 3 which is considered to have the simplest shape and is explained later is used for forming an LDD portion at the N channel portion, the gate width of the P channel portion becomes larger than the gate width of the N channel portion. Accordingly, by changing the half exposure mask, it is possible to set the width of the gate electrode of the N channel portion larger than the width of gate electrode of the P channel portion. Further, it is theoretically possible to make the gate electrode of the P channel portion and the gate electrode of N channel portion have the same electrode width by finely adjusting a pattern of the half exposure mask. However, it is meaningless to make both electrodes have the same width by performing such a fine adjustment and it is not realistic in view of actual manufacturing. Further, this embodiment is also characterized by the constitution that the size changes ΔS between the gate electrode of the P channel portion and the gate electrode of the N channel portion are equal between upper and lower sides in the drawing.

[0029] The C-MOS TFT element of this embodiment adopts the self-aligned C-MOS process in manufacturing thereof and hence, the C-MOS TFT element has no space for alignment at bonding portions of the P channel portion 25 and the N channel portion 26. Accordingly, the C-MOS TFT element can largely reduce the total space size thereof compared to a C-MOS TFT element having a space for such alignment.

[0030] Subsequently, an embodiment of the manufacturing process of the C-MOS TFT in the display device according to this embodiment is explained. Here, an example of conventional manufacturing process of a C-MOS TFT is also explained hereinafter for explaining advantageous effects of the present invention.

[0031]FIG. 3 is a schematic view for explaining the basic constitution of a half exposure mask used in manufacturing of the C-MOS TFT of the present invention. A constitutional material of the half exposure mask 40 which is also referred to as a half tone mask is preferably made of chromium and is constituted of a light transmitting portion 41 which allows light to completely pass therethrough, an non-light-transmitting portion 42 which completely interrupts light and a half light transmitting portion 43 which allows light to partially pass therethrough. In this embodiment, the half light transmitting portion 43 is formed of a large number of slits 43 a which are arranged in parallel continuously by way of bridges 42 a which constitute non-light-transmitting portions. In this embodiment, although the slits 43 a are formed perpendicular to the non-light-transmitting portion 42, a half exposure mask which forms slits parallel to the non-light-transmitting portion 42 can have a similar advantageous effect. Further, the half light transmitting portion 43 can be formed of these continuous slits, circular holes or other openings. Irrespective of the type of openings formed in the half light transmitting portion 43, the opening portions and the non-light transmitting portion are arranged at a level equal to or below a limit of resolution of the exposure light. It is needless to say that the half exposure mask 40 used in the present invention has the light transmitting portion 41, the non-light transmitting portion 42 and the half light transmitting portion 43 which correspond to a pattern of the C-MOS TFT.

[0032] Accordingly, in the half light transmitting portion 43 of the half exposure mask 40 shown in FIG. 3, the arrangement of the parallel slits 43 a and the bridge 42 a assumes a level equal to or less than a limit of resolution. With the use of this half exposure mask 40, in the exposure process of the photo step described later, given optical energy is irradiated to a resist portion exposed through the light transmitting portion 41 and optical energy which is below the above-mentioned given optical energy is irradiated to a resist portion exposed through the half light transmitting portion 43. Accordingly, when a negative resist is used, a crosslinking action of the portion exposed through the light transmitting portion 41 advances and reaches a lower layer of the resist, while a crosslinking action of the portion exposed through the half light transmitting portion 43 is stopped in the vicinity of the surface. When a positive resist is used, a reverse exposure operation is performed.

[0033]FIG. 4 and FIG. 5 are manufacturing process views of the C-MOS TFT for explaining one embodiment of the present invention. In these drawings, a cross section of the C-MOS TFT taken along a line B-B′ shown in FIG. 1 in respective processes is shown. First of all, an insulation layer 2 formed by laminating silicon oxide (SiO) and silicon nitride (SiN) is formed on a glass substrate 1 as a film and an amorphous silicon (a-Si) layer 3 is formed on the insulation layer 2. Subsequently, by applying the dehydrogenation processing and the excimer laser annealing (ELA) to the amorphous silicon layer 3, the amorphous silicon layer 3 is formed into polysilicon (p-Si). (Process P-1, hereinafter simply referred to as “P-1”.)

[0034] After applying a resist, a resist pattern having Si islands is formed by photolithography step and, thereafter, Si islands 4 are formed by dry etching. Then, a residual resist is removed. The resist is not shown in the drawing (P-2).

[0035] A gate insulation layer 5 formed of silicon oxide (SiO) is formed as a film on the Si islands 4 by a CVD method. Then, by performing the first ion implantation (E implantation 1 processing) for performing an N-type threshold value control, phosphorous (P) is doped into the Si islands 4 thus forming N-MOS Si islands 6 (P-3). Portions other than the P-MOS Si islands 7 portion are covered with a resist 90 by a photo step. By performing the second ion implantation (E implantation 2 processing) for performing a P-type threshold value control, boron is doped into the P-MOS Si islands 7 portion so that the P-MOS Si islands 7 are formed (P- 4 ).

[0036] After removing the resist 90, rapid thermal annealing (RTA) is performed so as to tighten the gate insulation layer 5 by baking so that the N-MOS Si islands 6 and the P-MOS Si islands 7 whose crystalline state is collapsed due to the E implantation 1 processing and the E implantation 2 processing are crystallized (P-5).

[0037] A gate metal layer 8 formed of molibudenum-20 wt % tungsten alloy (Mo-20 wt % W) is formed as a film by a sputtering method. Then, using the half exposure mask which is explained in conjunction with FIG. 3, patterns of half exposure resist 9, 9′ are formed by a photolithography method (P-6). Here, a state in which the pattern of the half exposure resist 9 exposed through the half light transmitting portion 43 has a thickness smaller than a thickness of the resist at the non-light-transmitting portion of the exposure mask is expressed by a convex shape. That is, shoulder portions of the convex shape constitute the half exposure region where the thickness of the resist is smaller than other portions. Reference symbol 9′ indicates the portion having no half exposure region.

[0038] Using an etchant formed of an aqueous solution into which phosphoric acid, nitric acid, acetic acid and ammonium fluoride are added, the gate metal layer 8 is etched by wet etching using a shower etching method. Here, side etching is performed in a state that a one-side retracting amount of the gate metal layer 8 by etching becomes 0.6 μm to 1.2 μm thus forming a self-aligned LDD gate electrode 10 (P-7).

[0039] The N⁺ portion 11 is formed by doping phosphorous into the N-MOS Si island 6 by implantation processing of about 3×10¹⁵ cm⁻² (P-8). Portions disposed at both sides of the N-MOS Si island 6 which are doped with phosphorous are indicated by symbol 11 in such a manner that these portions are defined from the N-MOS Si island 6.

[0040] Of the resist 9, the half exposure region which has a thickness smaller than a thickness of other portion is removed by ashing so as to form a P channel portion gate electrode resist pattern 12 and an N channel portion gate electrode resist pattern 12′ (P-9). In this case, there arises difference in resist width between the P channel portion gate electrode resist pattern 12 and the N channel portion gate electrode resist pattern 12′. Since the resist ashing is isotropic, the resists 9, 9′ reduce the resist widths thereof symmetrically with respect to a center axis of the gate line. Further, the resist 9 has the half exposure region different from the resist 9′ and hence, starting of reduction or shrinking of the resist width of the resist 9 is delayed. Accordingly, there arises the difference in the resist width size symmetrically with respect to the center axis of the gate line between the P channel portion gate electrode resist pattern 12 and the N channel portion gate electrode resist pattern 12′.

[0041] Then, using an aqueous solution into which phosphoric acid, nitric acid, acetic acid and ammonium fluoride are added, wet etching is performed so as to form a P channel portion gate electrode 13 and an N channel portion gate electrode 13′ (P-10). Here, the wet etching is performed such that the sides of the gate electrode 13′ of the N channel portion are not etched. It is also preferable to adopt dry etching in place of wet etching so as to reduce a side etching amount to 0.

[0042] As described above, there exists the difference in width size between the P channel portion gate electrode resist pattern 12 and the N channel portion gate electrode resist pattern 12′ and hence, as shown in the FIG. 1 (top plan view) and FIG. 2 which show the C-MOS element, there arises the differences amounting to ΔS between the width size of the P channel portion gate electrode 13 and the width size of the N channel portion gate electrode 13′. Th difference ΔS in resist width is equal at both sides in the width direction of both gate electrodes.

[0043] The N⁻ portion 14 of the N channel is formed by doping phosphorous into the N-MOS Si island 6 by implantation processing of about 3×10¹³ cm⁻². Here, the N⁻ portion 14′ is also simultaneously formed in the P channel region (P-11). Portions which are doped with phosphorous are indicated by symbols 14, 14′ in such a manner that the portions are defined from the N-MOS Si island 6 and the P-MOS Si island 7. Then, the resist is removed by ashing (P-12).

[0044] Portions other than the P-MOS Si island 7 are covered with a resist by a photolithography method (P-13).

[0045] The P-MOS Si island 7 is doped with boron (Br) by reverse implantation processing of about 10¹⁵ cm⁻². Due to this processing, the N⁻ portion 14 of the P channel region is modified to the P⁺ portion 15 (P-14). Accordingly, the already doped phosphorus of about 3×10¹³ cm⁻² is present in this P⁺ portion 15. The boron doped region which is modified into the P⁺ portion is indicated by symbol 15. The resist 90 is removed by ashing (P-15).

[0046] Due to the above-mentioned implantation, the P channel portion 25 has the structure in which the P⁺ polysilicon semiconductor layer and the N⁺ portion are present. Further, due to the above-mentioned implantation, the concentration of P⁺ doping atoms in the P⁺ polysilicon semiconductor layer which constitutes the P channel portion is about 10¹⁵ cm⁻² and the concentration of N⁻ doping atoms in the N⁻ portion is about 10¹³ cm⁻².

[0047] An interlayer insulation film 16 formed of SiO is formed by a CVD method (P-16). Then, the gate insulation layer 5 which is damaged by the implantation processing is tightened by baking by performing fast annealing (FA) and rapid thermal annealing (RTA) so as to activate the N-MOS Si island 6 and the P-MOS Si island 7.

[0048] A resist not shown in the drawing is applied such that the resist covers the interlayer insulation layer 16. Resist patterns of contact holes 17 in the N-MOS Si island 6 and the P-MOS Si island 7 are formed by a photolithography method. Thereafter, the interlayer insulation films 16 and 5 are etched by wet etching by a shower etching method using an etchant formed of an aqueous solution to which hydrogen fluoride and ammonium fluoride are added thus forming the contact holes 17 (P-17). Then, the resist is removed.

[0049] Titanium (Ti) which constitutes a barrier against Si, an aluminum-silicon alloy (Al-Si) which constitutes source/drain lines and Ti which constitutes a cap are laminated by a sputtering method so as to form a source/drain layer 18 (P-18).

[0050] A resist not shown in the drawing is applied such that the resist covers the source/drain layer 18. A resist pattern of source/drain lines is formed by a photolithography method and, thereafter, the resist pattern is etched by dry etching so as to form drain lines 19 (P-19). Then, the resist is removed.

[0051] A passivation layer 20 formed of silicon nitride (SiN) is formed by a CVD method (P-20). Then, the defective level of the inside and an interface of the Si film is terminated by hydrogen annealing.

[0052] An acrylic resin containing a photosensitive material is formed on the passivation layer 20 as a film and an organic insulation layer 21 in which a through hole pattern 22′ is formed by a photo step is formed on the passivation layer 20 (P-21)

[0053] Using the through hole pattern 22′ formed in the organic insulation layer 21 as a mask, the passivation layer 20 is etched by dry etching so as to form a through hole 22 (P-22).

[0054] By performing room-temperature film forming by adding a small quantity of water in the atmosphere during sputtering, an amorphous layer ITO is formed as a film such that the amorphous layer ITO covers the organic insulation layer 21. Then, a resist not shown in the drawing is applied to the amorphous ITO and a resist pattern of pixel electrodes is formed by a photo step. Thereafter, using oxalic acid of 3% concentration as an etchant, the amorphous ITO is etched by wet etching thus forming the pixel electrode 23 (P-23). Then, the resist is removed.

[0055] By adopting this process, it is possible to manufacture the TFT substrate for liquid crystal panel, for organic LED or other panel-type display device which mounts the C-MOS circuit thereon by carrying out the photolithography steps eight times and hence, the manufacturing cost can be largely reduced. Further, since the N-MOS and P-MOS can be formed by the self-aligned process, it is possible to realize the high integration of the C-MOS circuit.

[0056] Then, a color filter substrate is laminated to the TFT substrate and liquid crystal is sealed in a gap defined by lamination thus constituting the liquid crystal display device. Further, by applying an organic EL (OLED) material to the pixel electrodes of the TFT substrate and, further, by arranging counter electrodes on the organic EL (OLED) material, an organic LED display device is constituted. The TFT substrate of the present invention is applicable to a TFT substrate of an active matrix type display device of other type in the same manner.

[0057] Here, when the N-MOS and P-MOS are formed by the exposure mask alignment as will be explained later in conjunction with the conventional manufacturing process of C-MOS TFT or as explained in conjunction with previous FIG. 9, a mating portion 35 which takes the mask displacement into account is necessary and hence, the high integration is difficult. By adopting the half exposure mask of this embodiment and the self-aligned C-MOS process explained in conjunction with FIG. 4 and FIG. 5, it is possible to mount the highly integrated peripheral circuits on a glass substrate having a large area and hence, the low-temperature polysilicon TFT panel having large screen and exhibiting high definition and rapid driving on which a shift register, a DA converter circuit, a logic circuit and the like are highly integrated can be manufactured.

[0058]FIG. 6 is a manufacturing process view of a C-MOS TFT for explaining another embodiment of the present invention. Also in this embodiment, FIG. 6 shows a C-MOS cross section taken along a line B-B′ shown in FIG. 1 in respective processes. In FIG. 6, only the constitutional features of this embodiment are shown. The processes of this embodiment ranging from (P-1) to (P-6) in FIG. 4, that is, the processes in which the gate metal layer 8 is formed and patterns of half exposure resists 9, 9′ are formed using the half exposure mask shown in FIG. 3 are equal to those of the previous embodiment.

[0059] After forming the patterns of half exposure resists 9, 9′ (P-60), the gate metal layer 8 is etched by dry etching (P-61) The N⁺ portion 11 is formed by doping phosphorous into the N-MOS Si island 6 by implantation processing of about 3×10¹⁵ cm⁻² (P-62).

[0060] Thereafter, remaining resists 9, 9′ are removed by ashing so as to form a P channel portion gate electrode resist pattern 12 and an N channel portion gate electrode resist pattern 12′ (P-63). In this case, there arises difference in resist width between the P channel portion gate electrode resist pattern 12 and the N channel portion gate electrode resist pattern 12′. Although the size difference depends on an ashing amount and a film thickness of a half exposure portion resist film (portion of the resist 9 having a small thickness), this embodiment is characterized in the size difference is present symmetrically with respect to the center axis of the line of the gate electrode (size changes ΔS shown in FIG. 2 being equal). To the contrary, with respect to the mask alignment in the conventional process, it is uncertain how the size differences are displaced and hence, there is no assurance that the displacement of the width sizes takes a line symmetry.

[0061] A P channel portion gate electrode 13 and an N channel portion gate electrode 13′ are formed by dry etching (P-64). There exists the difference in width size between the P channel portion gate electrode resist pattern 12 and the N channel portion gate electrode resist pattern 12′ and hence, as shown in FIG. 1 (top plan view) which shows the C-MOS element, there arise the difference between the width size of the P channel portion gate electrode 13 and the width size of the N channel portion gate electrode 13′ (see FIG. 2). The method which comes thereafter starting from the formation of an N⁻ portion 14 of an N channel and a N⁻ portion 14′ of a P channel (P-65) is substantially equal to the method which has been explained in conjunction with step (P-11) in FIG. 4 to step (P-23) in FIG. 5 which explain the embodiment 1.

[0062] In this embodiment, the step for retracting the resist for forming the LDD an the step for forming the resist of the gate electrodes of the P channel TFT by removing the resist of the half exposure portions are the same step. Accordingly, it is important to form the half exposure resist having a film thickness corresponding to a required LDD width.

[0063] Also in this embodiment, it is possible to mount the highly integrated peripheral circuits on a glass substrate having a large area and hence, the low-temperature polysilicon TFT panel having a large screen and exhibiting high definition and rapid driving on which a shift register, a DA converter circuit, a logic circuit and the like are highly integrated can be manufactured.

[0064] Then, to clarify the difference between the present invention and the prior art, the manufacturing process of the C-MOS p-Si TFT according to the prior art is explained.

[0065]FIG. 7 is a manufacturing process view of the C-MOS p-Si TFT for explaining one example of the prior art. Here, the respective processes are shown as the cross section of the C-MOS. Processes up to the formation of the gate metal layer 8 are substantially equal to the processes of one embodiment of the present invention which have been explained in conjunction with FIG. 4 and hence, processes which come thereafter are explained.

[0066] A pattern of a resist 90 for gate metal electrodes is formed by a photo step (P-70) and the gate metal layer 8 is etched by wet etching or dry etching so as to form gate electrodes 24 (P-71).

[0067] The patterned resist out of the resist 90 is removed by peeling using an organic alkali or by ashing (P-72).

[0068] Portions other than an N⁺ portion 27 are covered with the resist 90 by a photolithography method. Then, the N⁺ portion 27 is formed by doping phosphorous into the N-MOS Si island 6 by implantation processing of about 3×10¹⁵ cm (P-73). The resist 90 is removed (P-74).

[0069] Portions other than an N channel portion 26 are covered with the resist 90 by a photolithography method. Then, the N⁻ portion 28 is formed by doping phosphorous into the N-MOS Si island 6 by implantation processing of about 3×10¹³ cm⁻² (P-75). The resist 90 is removed (P-76).

[0070] Portions other than a P channel portion 25 are covered with the resist 90 by a photolithography method. Then, the P⁺ portion 29 is formed by doping boron into the P-MOS Si island 7 by implantation processing of about 3×10¹⁵ cm⁻² (P-77). The resist 90 is removed (P-78). The method which comes thereafter starting from the formation of an interlayer insulation film is substantially equal to the method which has been explained in conjunction with FIG. 4.

[0071] When the C-MOS p-Si TFT is manufactured by this method, it is necessary to perform the photolithography steps ten times and hence, the manufacturing cost is pushed up.

[0072]FIG. 8 is a manufacturing process view of a C-MOS p-Si TFT shown in FIG. 9 which adopts the self-aligned LDD for explaining the another example of the prior art. Here, the respective processes are shown in the C-MOS cross section taken along a line C-C′ in FIG. 9. Processes up to the film formation of the gate metal layer 8 are substantially equal to those of one embodiment of the present invention which have been explained in conjunction with FIG. 4 and hence, processes which come after the film formation of the gate metal layer 8 are explained hereinafter.

[0073] After forming the gate metal layer 8, a pattern of a resist 90 for self-aligned LDD is formed by a photolithography step (P-80). Using an etchant formed of an aqueous solution into which phosphoric acid, nitric acid, acetic acid and ammonium fluoride are added, the gate metal layer 8 is etched by wet etching using a shower etching method. Here, side etching is performed in a state that a one-side retracting amount of the gate metal layer 8 by etching becomes 0.6 μm to 1.2 μm thus forming a self-aligned LDD gate electrode 30 (P-81).

[0074] Using this resist 90 as a mask, an N⁺ portion 31 is formed by doping phosphorous into an N-MOS Si island 6 by implantation processing of about 3×10¹⁵ cm⁻² (P-82). The resist 90 is removed.

[0075] Using the self-aligned LDD gate line 30 as a mask, an N⁻ portion 32 is formed by doping phosphorous into an N-MOS Si island 6 by implantation processing of about 3×10¹³ cm⁻(P-83).

[0076] Portions of the P channel portion 25 which constitute the gate electrodes of the gate metal layer 8 and portions of the N channel portion 26 are covered with the resist 90 by the photolithography method (P-84).

[0077] The gate metal layer 8 of the P channel portion 25 is etched by dry etching thus forming the P channel portion gate electrode 33 (P-85).

[0078] The P-MOS Si island 7 is doped with boron by implantation processing of about 10¹⁵ cm⁻² thus forming a P⁺ portion 34 (P-86) The resist 90 is removed (P-87).

[0079] The method which comes thereafter starting from the formation of an interlayer insulation film is substantially equal to the method which has been explained in conjunction with FIG. 4 of one embodiment of the present invention.

[0080] When the C-MOS TFT is manufactured by this method, the gate electrode 13 of the P channel portion 25 and the gate electrode 13′ of the N channel portion 26 are formed by separate photo steps and hence, it is necessary for the gate electrodes 13 and 13′ to have mating portions at a connection portion between the P channel portion 25 and the N channel portion 26 as shown in FIG. 9. Accordingly, it is appreciated that the high integration of the C-MOS circuit is difficult by this method.

[0081] Here, by laminating a color filter substrate on which, for example, color filters, common electrodes and the like are formed as a counter substrate to the thin film transistor substrate on which the driving circuits and the active elements which use the above-mentioned C-MOS thin film transistors are formed, and by sealing liquid crystal in a gap defined between opposing substrates, it is possible to constitute a liquid crystal display device. Further, by laminating organic EL layers on regions of pixel electrodes provided to active elements formed on the thin film transistor substrate and by laminating another electrodes such that the organic EL layers are sandwiched by electrodes, it is possible to constitute an organic EL display device.

[0082] It is needless to say that the present invention is not limited to the above-mentioned embodiments and various modifications are conceivable within the scope of the technical concept of the present invention. For example, although the semiconductor layers are formed of polysilicon in this specification, semiconductors may be formed of single crystal or of pseudo single crystal having properties between properties of the single crystal and properties of the polysilicon. Further, although the LDD structure is formed only in the N type transistor region in this specification, the LDD structure may be configured to be formed on the P type transistor region.

[0083] Further, as shown in FIG. 1 and FIG. 2, the C-MOS thin film transistor is formed on the substrate of the display device and the C-MOS thin film transistor is configured such that the gate electrode of the P channel portion and the gate electrode of the N channel portion are connected on the substantially straight line and the P channel portion and the N channel portion are arranged close to each other. Accordingly, it is possible to manufacture the space-saving C-MOS TFT which can eliminate the aligning portion such as one shown in FIG. 9 so that the high integration of the C-MOS TFTs can be realized. It is needless to say that even in such a constitution, the gate electrode width of the P channel portion and the gate electrode width of the N channel portion differ from each other. Further, the connection at the connection portion between the gate electrode of the P channel portion and the gate electrode of the N channel portion is established with the width which is equal to or more than the narrower gate electrode width out of the gate electrode width of the P channel portion and the gate electrode width of the N channel portion or equal to or less than the broader gate electrode width out of the gate electrode width of the P channel portion and the gate electrode width of the N channel portion. In the drawing describing the embodiments, the gate electrode width of the P channel portion is set broader than the gate electrode width of the N channel portion. Further, the gate electrode of the P channel portion and the gate electrode of the N channel portion of the C-MOS thin film transistor have equal differences with respect to the gate line width of the connection portion in the widthwise direction.

[0084] Further, although the constitution of the C-MOS p-Si TFT has been described in this specification, the C-MOS TFT is not limited to the C-MOS p-Si TFT. This merely implies that since the C-MOS p-Si TFT is advantageous in view of high definition and fast operation, the use of the C-MOS p-Si TFT is preferable.

[0085] As has been described heretofore, according to the present invention, by adopting the self-aligned C-MOS process which uses the half tone mask as the exposure mask for manufacturing the C-MOS mounted on the display device, the positioning becomes no more necessary at the bonding portion between the P-MOS TFT and the N-MOS TFT and hence, it is possible to achieve the high integration with the least number of photo steps whereby the display device which exhibits high definition and rapid driving can be realized. 

What is claimed is:
 1. A display device including C-MOS thin film transistors on a substrate, wherein a width of a gate electrode of a P channel portion and a width of a gate electrode of an N channel portion of the C-MOS thin film transistor are different from each other.
 2. A display device according to claim 1, wherein the gate electrode of the P channel portion and the gate electrode of the N channel portion are connected on a substantially straight line.
 3. A display device according to claim 1, wherein the width of the gate electrode of the P channel portion is broader than the width of the gate electrode of the N channel portion.
 4. A display device according to claim 3, wherein the gate electrode of the P channel portion and the gate electrode of the N channel portion are connected on a substantially straight line.
 5. A display device according to claim 1, wherein the C-MOS thin film transistor is a C-MOS polysilicon thin film transistor.
 6. A display device according to claim 1, wherein the gate electrode of the P channel portion and the gate electrode of the N channel portion of the C-MOS thin film transistor have equal differences in a gate line width at a connection portion in the widthwise direction.
 7. A display device according to claim 1, wherein a P⁺ semiconductor region and an N⁻ doping region are present in the P channel portion.
 8. A display device according to claim 7, wherein the concentration of P⁺ doping atoms in the P⁺ semiconductor region which constitutes the P channel portion is about 10¹⁵ cm⁻² and the concentration of N⁻ doping atoms in the N⁻ doping region is about 10¹³ cm⁻².
 9. A display device according to claim 1, wherein a P⁺ semiconductor region which constitutes the P channel portion includes N⁻ doping atoms as impurities.
 10. A display device being constituted such that C-MOS thin film transistors are formed on a substrate of a display device, the C-MOS thin film transistor is comprised of a P-MOS thin film transistor and a N-MOS thin film transistor, the P-MOS thin film transistor and the N-MOS thin film transistor are connected by a gate electrode on a substantially straight line, a width of a gate electrode of the P-MOS thin film transistor and a width of the gate electrode of the N-MOS thin film transistor are different from each other, and a connection at a connection portion between the gate electrode of the P-MOS thin film transistor and the gate electrode of the N-MOS thin film transistor is established with a width which is equal to or more than the narrower gate electrode width out of the gate electrode width of the N-MOS thin film transistor and the gate electrode width of the P-MOS thin film transistor or equal to or less than the broader gate electrode width out of the gate electrode width of the P-MOS thin film transistor and the gate electrode width of the thin film N-MOS transistor.
 11. A display device according to claim 10, wherein the width of the gate electrode of the P-MOS thin film transistor is broader than the width of the gate electrode of the N-MOS thin film transistor.
 12. A display device being constituted such that C-MOS thin film transistors are formed on a substrate of a display device, a gate electrode of a P channel portion and a gate electrode of an N channel portion are connected on a substantially straight line in the C-MOS thin film transistor , and the P channel portion and the N channel portion are configured to be close to each other.
 13. A display device according to claim 12, wherein a width of the gate electrode of the P channel portion and a width of the gate electrode of the N channel portion are different from each other.
 14. A display device according to claim 13, wherein a connection at a connection portion between the gate electrode of the P channel portion and the gate electrode of the N channel portion is established with a width which is equal to or more than the narrower gate electrode width out of the gate electrode width of the P channel portion and the gate electrode width of the N channel portion or equal to or less than the broader gate electrode width out of the gate electrode width of the P channel portion and the gate electrode width of the N channel portion.
 15. A display device according to claim 14, wherein the gate electrode width of the P channel portion is broader than the gate electrode width of the N channel portion.
 16. A display device according to claim 15, wherein the gate electrode of the P channel portion and the gate electrode of the N channel portion of the C-MOS thin film transistor have equal differences in a gate line width at a connection portion in the widthwise direction.
 17. A display device according to claim 12, wherein a P⁺ semiconductor region and an N⁻ doping region are present in the P channel portion.
 18. A display device according to claim 17, wherein the concentration of P⁺ doping atoms in the P⁺ semiconductor region which constitutes the P channel portion is about 10¹⁵ cm⁻² and the concentration of N⁻ doping atoms in the N⁻ doping region is about 10¹³ cm⁻².
 19. A display device according to claim 12, wherein a P⁺ semiconductor region which constitutes the P channel portion includes N⁻ doping atoms as impurities.
 20. A display device according to claim 12, wherein the C-MOS thin film transistors are C-MOS polysilicon thin film transistors. 